Samsung
Samsung is readying up some pretty innovative tech : stacking memory on a CPU or a GPU to potentially drastically ameliorate performance . Switching to this proficiency may affect operation , power efficiency , and capacity . Unfortunately , many of us will never directly experience the benefits of this , as Samsung is pop off to practice its gamey - bandwidth memory ( HBM ) , meaning we wo n’t find out it even in thebest graphics cardsavailable .
The tech in question call for a new 3D packaging method that belong to Samsung ’s Advanced Interconnect Technology ( SAINT ) platform , with this later loop being knight SAINT - D. Each version involves a different 3D stacking technology , with SAINT - S pile the SRAM go bad on top of the logic dice ; SAINT - L heap logic ; and in the end , SAINT - D stack HBM memory on top of logical system chips , think of either C.P.U. or GPUs .
Samsung
SAINT - D introduces stack HBM vertically on top of the processor and get in touch it through a substrate between the two chip . This is a Brobdingnagian change from Samsung ’s current 2.5D packaging approach , which associate the HBM chips to the GPU horizontally with a silicon interposer .
The intro of 3D packaging could be the first step toward launching Samsung ’s next - gen HBM4 . Samsung itself refers to SAINT - D as a “ DRAM breakthrough for HPC and AI . ” The company also described the benefits of using this technique , as cited byThe Korea Economic Daily : “ 3D promotion reduce major power consumption and processing delays , improving the quality of electric signal of semiconductor potato chip . ”
As announced during the Samsung Foundry Forum 2024 , the companionship will provide its raw 3D HBM packaging as part of a turnkey service of process . This signify an ending - to - end solvent where Samsung will both produce the HBM chips and integrate them onto GPUs for fabless company . As SAINT - D is said to be get its debut this twelvemonth , and the next - gen HBM4 framework is set to get in 2025 , this new method acting could make quite the splash in HPC purpose example very shortly , including various AI uses .
Samsung ’s breakthrough does n’t mean much for consumer — not yet . HBM retentiveness is , as the name itself involve , used in high-pitched - execution environments , and to top it all off , this 3D packaging technology is reportedly even more expensive to produce than its predecessors . However , 3D VRAM is an interesting concept . Perhaps if it work out well in data substance , it may one Clarence Shepard Day Jr. make its way to our PCs .
